About Us

Astropack Technology was founded to address the critical packaging need of today’s semiconductor industry. The packaging cost of the advanced semiconductor packaging used in networking and other mass consumer market exceeds the cost of silicon in most cases. The packaging technology has not kept up with the advances in silicon wafer processing technology which reduces the sizes of silicon using sub nano meter nodes and large wafer size which increases the number of silicon dies per wafer. The feature size in packaging is till in the several micron range which increases the package size and cost.

The other critical needs for today packaging technology is to reduce or eliminate the field reliability failures which cost the industry several billion dollars due to uncharacterized materials and process used in packaging that that result in recall of automotive components or replacement of expensive value added mother boards.

Small IC design start up do not have the necessary in house resource and should better focus on product design and let us provide the packaging support and outsource management.