Services

1. Design :
Lay out design , validation (including DRC) and optimization, starting with your ideas and delivering Mask ready CAD drawings for MEMS and IC packaging.

2. Package Simulation:
Our simulation team is dedicated to package design optimization through FEM Modeling.
We have a dedicated team of Engineers and scientist with several years of experience in FEM modeling for optimum cost effctive packaging thermal, electrical design to ensure long term reliability.

• Mechanical analysis
• Thermal modeling
• Electrical analysis
• Multi domain modeling
• Coupled electro-mechanical
• Thermo-mechanical or
• Thermo electro mechanical

3.Prototype samples:
Our offshore team can work with clients Supply chain and the product core teams to expedite the proto type builds for design verification/ validation and customer samples.

4. High volume manufacturing:
Prototypes are transferred to high volume manufacturing partners offshore after successful design verification and validation.

5. Quality and reliability failures:
Our experienced team can quickly identify the root cause and suggest corrective action for your quality and reliability qualification failures.

Specialties:

Packaging IP Generation ● Risk Assessment ●Project Management ● Backend / Assembly ● Six sigma/Lean Manufacturing ● Continuous Improvement ● Failure analysis● Process Development ● Root cause Identification ● Corrective Action ● Design for manufacturability ● Design Guidelines ● QC / QA ● Cost Reduction ● Risk Management ● Strategic Sourcing ●Transferring to high volume production● New product introduction