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Vision Mission

We started in 1979 Santa Clara at Intel in package development and setting up a lab for incoming controls on the packages materials research. Over these years, we have evolved into an concept production to business solutions and package development company, The rare combination of semiconductor industry exposure in packaging material selection, characterization and optimization with package simulation and design with using do it right the first time philosophy we have successfully designed complex packaging solutions from concept to high volume production for memories, microprocessors, net working modules, automotive sensors, MEMS and medical devices. We have experienced off shore support for cost effective design and BOM optimization by FEM and transferring proto type designs after verification and validation by clients to high volume production. We offer a cost effective alternative to having a full fledged experienced packaging engineering staff in house.

• The Mission Statement – AstroPack Technology business is all about
reducing the overall Microelectronics packaging cost while eliminating
performance and reliability failures up front by design and simulation.