Who We Are

We started in 1979 Santa Clara at Intel in package development and setting up a lab for incoming controls on the packages materials research. Over these years, we have evolved into an concept production to business solutions and package development company, The rare combination of semiconductor industry exposure in packaging material selection, characterization and optimization with package simulation and design with using do it right the first time philosophy we have successfully designed complex packaging solutions from concept to high volume production for moonrise, microprocessors, net working modules, automotive sensors, MEMS and medical devices. We have experienced off shore support for cost effective design and BOM optimization by FEM and transferring proto type designs after verification and validation by clients to high volume production. We offer a cost effective alternative to having a full fledged experienced packaging engineering staff in house.

Harry Liu has Mechanical Engineering bachelor degree from Shanghai JiaoTong University and master degree of Industrial and Engineering Management from Singapore NUS. He has 21 years of IC assembly and packaging management experience in Operation, Process Development, R&D, FA Analysis and NPI Management. He has worked in both IDM (National Semiconductor, STM, Delphi and NXP) and OSAT (CS2 Belgium and UTAC) environment. He has been involved extensively in process and package development for leaded ad laminated packages and mostly recently SIP/Module products and flip-chip production line set-up for RF devices which are widely used in current major smart phone suppliers.

Rahamat Bidin has B. Engineering(Mech.) from NUS and MBA in Mgt of Technology from NTU. He has almost 30 years of IC assembly and packaging management experience in Operation , Process Engineering,NPI and R&D working in both IDM(National Semiconductor/Dataplay) and OSAT( Statschipac and Utac) Environment. Has been involve extensively in process and package development for leaded and laminate packages and most recently SIP/Module for Memory,Power,RF,CIS and MEMS applications. Has publish several technical papers and file Patents in the course his works. Also been involve in several factory and product line start up both in Singapore and China.

Bogdan Firtat graduated in Electronics and Telecommunications, he holds a Master degree in Quality and Reliability Engineering and he is a PhD student on Microsystems. He has over 13 years of experience in micro/nano systems design, simulation and modelling for mechanical, chemical and biological microsensors. FEM microfluidic modelling is also a strong point in his resume. His scientific activities reflect in over 35 published papers, in journals and conference proceedings and he was appointed as an independent expert for the European Commission.